SILCA HEAT 600C is an innovative material designe especially for
building „warm” fireplaces. The SILCA HEAT 600C board combines two
functions. Firstly, thanks to its special construction it conducts the heat
generated in the fireplace insert outside the housing. It is characterized
by great thermal conductivity and low expandability. The SILCA HEAT
600C board is a hybrid material based on calcium-silicate and carbon.
The high content of graphite results in a excellent conductivity
parameters. The thermal resistance is 1000 °C and the board is nonflammable.
The boards are available in sizes: 1000x625x25 mm and
1000x625x35 mm. Other formats and arch-shapes are available on
special order.
Working with SILCA HEAT 600C boards is easy, quick and safe. Solid,
constructional boards can be worked on by using regular carpenting
tools. For glueing the boards the SILCACON glue should be used. For
reinforcements use screws. It is advised to make an reinforcing layer by
using the SILCATEX net. Due to high temperatures the SILCA HEAT
600C boards should not be undercoated! It is advised to use the
SILCADUR-HTI impregnant before plastering or application of any
other layers such as tiles or natural stone.
In the housing made of SILCA HEAT 600C boards it is advised to use
fireplace grates according to manufacturer’s instructions. ATTENTION!
The SILCA HEAT 600C board is not an insulation board, therefore in
places requiring insulation the SILCA 250KM board should be used.
Advantages of SILCA HEAT 600C:
- space savings thanks to its smal size
- light weight
- thermoconductive material - excellent
thermal conductivity
- construction material, easy to work on with
traditional carpentry tools
- high thermal resistance and shape stability
- compatible with insulation boards SILCA
- non-flammable product
- safe for health and environment
SILCA HEAT 600C parameters:
- conform with EN 14306
- density: 650 kg/m3
- fire classification: non-flammable
A1
- thermal resistance: 1000°C
- resistance to pressure: 7,0 MPa
- resistance to bending: 3,0 MPa
- thermal conductivity: 300°C –
800°C ~ 0,2-0,3 W/mK
- thermal expandability at 500°C:
0,3%